Qfn package dimensions



Keywords: qfn, mlf, mlp, vqfn, dfn, lfcsp, quad flat no-lead, mlf-s, mlfs, mfl, power package, mlf s, son, lpcc, leadless plastic chip carrier, power packages, mlf2, mlp, e-pad, mlf-2, leadless, mlp2, micro lead frame, microlead, micro, leadframe, microleadframe, mlf, qfm, micro leadframe package, micro lead frame package, pwb, csp, copper, exposedpad, mlfp, rf packages, packages for rf, exposed die packages, exposed die package, exposed die, hdlf, bcc, lfcsp, chipscale, bump chip carrier, micro lead package
Description: Amkor's MicroLeadFrame (MLF/QFN/MLP/VQFN/LFCSP) package is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the PWB.

Amkor's MicroLeadFrame® (MLF | MLP | LFCSP | VQFN | QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the PWB. The package also offers Amkor's ExposedPad technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB. This enhancement also enables stable ground by use of down bonds or by electrical connection through a conductive die attach material.

Amkor Technology offers its QFN package design kit for Agilent Technologies’ Advanced Design System (ADS) electronic design automation software. Based on Amkor’s popular MicroLeadFrame® packages, the package design kit gives ADS users access to the full fidelity of Amkor packages at the click of a button. This allows them to reduce design spins and cut time-to-market by rapidly characterizing circuits in the presence of actual Amkor packages, before manufacturing and performing what-ifs. Download the ADS Kit here.

  • Small size (reduce package footprint by 50% or more and improved RF performance) & weight
  • Standard leadframe process flow and equipment
  • Excellent thermal and electrical performance
  • 0.4 mm to 2.03 mm maximum height
  • 4 to 180 I/O
  • 1 - 13 mm Body size
  • Thin profile and superior die to body size ratio
  • Pb Free / Green
  • Flexible Designs and High Yields
  • SAW and Punch versions available






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